Title :
High-end microprocessors
Author_Institution :
Intel Corporation, Aloha, OR, USA
Abstract :
The problems associated with technology developments, packaging, chip and system characteristics for next generation high-end microprocessors now beginning to appear on the market will be explored in this session.
Keywords :
Bandwidth; Computer architecture; High level languages; Integrated circuit packaging; Integrated circuit technology; Large scale integration; Microprocessors; Power dissipation; Software packages; Space technology;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1978 IEEE International
Conference_Location :
San Francisco, CA, USA
DOI :
10.1109/ISSCC.1978.1155810
