• DocumentCode
    2865438
  • Title

    Transfer of InGaP/GaAs double-junction micro-cuboid array onto foreign substrates using epitaxial lift-off (ELO) technique

  • Author

    Chao, Jiun-Jie ; Shiu, Shu-Chia ; Lin, Ching-Fuh

  • Author_Institution
    Grad. Inst. of Photonics & Optoelectron., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2009
  • fDate
    14-19 June 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    As a result of the ability to tune the band-gap of III-V compound semiconductor materials to match the solar spectrum, solar cells made from II -V materials such as GaAs and InGaP have unsurpassed conversion efficiencies. However, after the deposition of the solar cell film, the substrate is of no further use for its performance. The reduction of the costs of III-V semiconductor materials and the increase of the power to weight ratio are highly desired. The most successful method to achieve these goals is epitaxial lift-off (ELO). In order to shorten the ELO etching time and prevent the microscopic cleavage cracks, the authors develop a unique transplantation method. The steps in this technique were presented in this paper.
  • Keywords
    III-V semiconductors; epitaxial growth; gallium arsenide; indium compounds; semiconductor epitaxial layers; solar cells; sputter etching; InGaP-GaAs; compound semiconductor material; double junction microcuboid array; epitaxial lift-off technique; etching time; microscopic cleavage crack; solar cell film deposition; solar spectrum; transplantation method; Costs; Etching; Gallium arsenide; III-V semiconductor materials; Microscopy; Photonic band gap; Photovoltaic cells; Semiconductor films; Semiconductor materials; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics 2009 and the European Quantum Electronics Conference. CLEO Europe - EQEC 2009. European Conference on
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4244-4079-5
  • Electronic_ISBN
    978-1-4244-4080-1
  • Type

    conf

  • DOI
    10.1109/CLEOE-EQEC.2009.5196497
  • Filename
    5196497