DocumentCode :
2866504
Title :
Defect localization using physical design and electrical test information
Author :
Stanojevic, Zoran ; Balachandran, Hari ; Walker, D.M.H. ; Lakhani, Fred ; Jandhyala, Sri
Author_Institution :
Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
fYear :
2000
fDate :
2000
Firstpage :
108
Lastpage :
115
Abstract :
In this work we describe an approach of using physical design and test failure knowledge to localize defects in random logic. We term this approach computer-aided fault to defect mapping (CAFDM). An integrated tool has been developed on top of an existing commercial ATPG tool. CAFDM was able to correctly identify the defect location and layer in all 9 of the chips that had bridging faults injected via FIB. Preliminary failure analysis results on production defects are promising
Keywords :
automatic test pattern generation; failure analysis; fault diagnosis; focused ion beam technology; integrated circuit design; integrated circuit testing; logic testing; production testing; ATPG tool; CAFDM; FIB; bridging faults; computer-aided fault to defect mapping; defect localization; electrical test information; failure knowledge; physical design; production defects; random logic; Automatic test pattern generation; Circuit faults; Circuit testing; Failure analysis; Fault diagnosis; Inspection; Instruments; Logic testing; Scanning electron microscopy; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
Conference_Location :
Boston, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-5921-6
Type :
conf
DOI :
10.1109/ASMC.2000.902568
Filename :
902568
Link To Document :
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