Title :
A 4-element X-band CMOS phased-array RFIC in a QFN package
Author :
Shin, Donghyup ; Kim, Choul-Young ; Kang, Dongwoo ; Rebeiz, Gabriel M.
Author_Institution :
University of California, San Diego, La Jolla, 92093-0407, USA
Abstract :
This paper presents a QFN packaged phased-array RFIC for X-band applications. The transmit X-band phased array is differential except for baluns at the input and output ports. Electromagnetic simulation is done to result in low channel-to-channel coupling. Measurements show a wideband impedance match and a worst-case channel-to-channel coupling of < −29 dB at 8–10 GHz. The results show that phased-array chips can be packaged using QFN techniques, and paves the way for low-cost phased arrays.
Keywords :
Arrays; CMOS integrated circuits; Couplings; Impedance matching; Phase measurement; Radiofrequency integrated circuits; Semiconductor device measurement; CMOS; Packaging; Phased array; Planar antennas; RFIC; SiGe;
Conference_Titel :
Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
Conference_Location :
Montreal, QC, Canada
Print_ISBN :
978-1-4673-1085-7
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2012.6259586
