Microwave susceptor design for wafer bonding applications

In this paper we present a new approach in the design of microwave susceptors to develop a low-cost, controllable and rapid localized heating technique for wafer bonding. In this technique, a commercial microwave oven is used as microwave source due to its low cost and wide accessibility. The microwave oven is modeled and efficient microwave susceptors are designed. Fabricated susceptors are tested inside a commercial microwave oven and show controllable rapid selective heating.