Title :
Software Life-Extension: A New Countermeasure to Software Aging
Author :
Machida, Fumio ; Jianwen Xiang ; Tadano, Kumiko ; Maeno, Y.
Author_Institution :
NEC Knowledge Discovery Res. Labs., Kawasaki, Japan
Abstract :
This paper presents software life-extension, a new technique for counteracting software aging by preventive operation to extend the lifetime of software execution. Software aging is a phenomenon of progressive degradation of execution environment due to aging-related software faults and it might cause resource depletion resulting in system failures. To extend the lifetime of the software affected by aging, we use a virtual machine to execute the software and allocate additional memory to the virtual machine upon software aging detection. Although software life-extension is a temporal solution as it only postpones the occurrence of a failure, it provides a simple, cost-effective, and non-intrusive countermeasure to software aging. The feasibility and effectiveness of software life-extension are studied by the experiments on memcached, a widely adopted general-purpose in-memory cache server. From the experimental results, we present a Semi-Markov process (SMP) describing the general behavior of software life-extension and analyze the model which gives the prediction of the system availability as well as the user-perceived availability.
Keywords :
cache storage; software fault tolerance; software maintenance; aging-related software faults; execution environment; general-purpose in-memory cache server; memory allocation; nonintrusive countermeasure; preventive operation; progressive degradation; resource depletion; semi-Markov process; software aging detection; software execution lifetime; software life-extension; system failures; user-perceived availability; virtual machine; Aging; Availability; Degradation; Memory management; Random access memory; Resource management; Software; availability; life-extension; memcached; software aging; software rejuvenation;
Conference_Titel :
Software Reliability Engineering (ISSRE), 2012 IEEE 23rd International Symposium on
Conference_Location :
Dallas, TX
Print_ISBN :
978-1-4673-4638-2
DOI :
10.1109/ISSRE.2012.19