• DocumentCode
    2868167
  • Title

    High end microprocessors: Third generation

  • Author

    Lattin, W.

  • Author_Institution
    Intel Corp., Aloha, OR, USA
  • Volume
    XXII
  • fYear
    1979
  • fDate
    14-16 Feb. 1979
  • Firstpage
    94
  • Lastpage
    94
  • Abstract
    This session will focus on the current generation of microprocessors now becoming available from semiconductor manufacturers, which feature, generally, new and innovative architecture proposed to solve system and software problems, such as high level language support, increased addressability, and a rich variety of data types. The role of these new developments for users will be accented.
  • Keywords
    Computer aided manufacturing; Computer architecture; Costs; Educational institutions; Hardware; Microprocessors; Packaging; Semiconductor device manufacture; Software packages; Software systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference. Digest of Technical Papers. 1979 IEEE International
  • Conference_Location
    Philadelphia, PA, USA
  • Type

    conf

  • DOI
    10.1109/ISSCC.1979.1155984
  • Filename
    1155984