Title :
High end microprocessors: Third generation
Author_Institution :
Intel Corp., Aloha, OR, USA
Abstract :
This session will focus on the current generation of microprocessors now becoming available from semiconductor manufacturers, which feature, generally, new and innovative architecture proposed to solve system and software problems, such as high level language support, increased addressability, and a rich variety of data types. The role of these new developments for users will be accented.
Keywords :
Computer aided manufacturing; Computer architecture; Costs; Educational institutions; Hardware; Microprocessors; Packaging; Semiconductor device manufacture; Software packages; Software systems;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1979 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1979.1155984
