DocumentCode
2868666
Title
Two-phase thermosyphon device for the large thyristors cooling
Author
Bordignon, P. ; Ragni, A. ; Latrofa, E. ; Casarosa, C.
fYear
1988
fDate
11-14 April 1988
Firstpage
1346
Abstract
An advanced device is presented for the cooling of large thyristors, using silicon wafers of 75 and 100 mm diameter and their dissipating auxiliary components, such as snubber resistors. The device takes advantage of the two-phase thermosyphon principle and is designed for forced-air cooling. Results obtained from tests on a few samples indicate that the technique is suitable for obtaining thermal control of even the largest thyristors, guaranteeing the full utilization of their current-handling capability.<>
Keywords
cooling; heat sinks; thyristors; 100 mm; 75 mm; dissipating auxiliary components; forced-air cooling; heat sinks; snubber resistors; thermal control; thyristor cooling; two-phase thermosyphon principle; Costs; Electronics cooling; Heat sinks; Heat transfer; Resistors; Silicon; Snubbers; Testing; Thermal resistance; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 1988. PESC '88 Record., 19th Annual IEEE
Conference_Location
Kyoto, Japan
Type
conf
DOI
10.1109/PESC.1988.18281
Filename
18281
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