Title :
ELECTROMIGRATION EFFECTS IN VLSI DUE TO VARIOUS CURRENT TYPES
Author :
Weis, E. ; Kinsbron, E. ; Snyder, M. ; Vogel, B. ; Croitoru, N.
Keywords :
Circuit testing; Conductors; Current density; Electromigration; Fabrication; Life estimation; Lifetime estimation; Stress; Temperature; Very large scale integration;
Conference_Titel :
Test Conference, 1991, Proceedings., International
Print_ISBN :
0-8186-9156-5
DOI :
10.1109/TEST.1991.519694
