3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities

Author

Fazzi, Alberto ; Canegallo, Roberto ; Ciccarelli, Luca ; Magagni, Luca ; Natali, Federico ; Jung, Erik ; Rolandi, Pier Luigi ; Guerrieri, Roberto

Author_Institution

ARCES, Bologna Univ.

fYear

2007

fDate

11-15 Feb. 2007

Firstpage

356

Lastpage

608

Abstract

A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum ² electrodes and this enables the vertical propagation of clock at 17GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/mum² with 0.08pJ/b energy consumption

Keywords

CMOS integrated circuits; capacitors; coupled circuits; integrated circuit interconnections; 0.13 micron; 17 GHz; 3D capacitive interconnections; 3D system integration; CMOS; RX-TX circuits; bi-directional capability; capacitive coupling; mono-directional capability; vertical propagation; wireless interconnection; Bidirectional control; Clocks; Coupling circuits; Delay; Electrodes; Energy consumption; Frequency; Integrated circuit interconnections; Transmitters; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2007. ISSCC 2007. Digest of Technical Papers. IEEE International

Conference_Location

San Francisco, CA

ISSN

0193-6530

Print_ISBN

1-4244-0853-9

Electronic_ISBN

0193-6530

Type

conf

DOI

10.1109/ISSCC.2007.373441

Filename

4242412