Title :
3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities
Author :
Fazzi, Alberto ; Canegallo, Roberto ; Ciccarelli, Luca ; Magagni, Luca ; Natali, Federico ; Jung, Erik ; Rolandi, Pier Luigi ; Guerrieri, Roberto
Author_Institution :
ARCES, Bologna Univ.
Abstract :
A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum 2 electrodes and this enables the vertical propagation of clock at 17GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/mum2 with 0.08pJ/b energy consumption
Keywords :
CMOS integrated circuits; capacitors; coupled circuits; integrated circuit interconnections; 0.13 micron; 17 GHz; 3D capacitive interconnections; 3D system integration; CMOS; RX-TX circuits; bi-directional capability; capacitive coupling; mono-directional capability; vertical propagation; wireless interconnection; Bidirectional control; Clocks; Coupling circuits; Delay; Electrodes; Energy consumption; Frequency; Integrated circuit interconnections; Transmitters; Voltage;
Conference_Titel :
Solid-State Circuits Conference, 2007. ISSCC 2007. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
1-4244-0853-9
Electronic_ISBN :
0193-6530
DOI :
10.1109/ISSCC.2007.373441
