Finite element modeling of the Modules in transmitter-receiver

This paper presents modal analysis of electronic devices by a finite element analysis (FEA) modal calibrated with test data. The electronic device under investigation is the module of transmitter-receiver, a product that is frequently exposed to vibration. The module is consisted of frame and printed circuit board (PCB) with various attached electronic components. In this study, an FEA model is established with the use of SolidWorks and ANSYS. The elastic modulus for these regions is determined by static test. The modal shape and natural frequencies of the module is compared with measurement. The result shows that the predicted frequency matches with test data. In addition, the modal analysis of frame and PCB components are done respectively. The FEA result shows that the module´s natural frequency is mainly determined by PCB. The FEA modal result can help engineers to improve the module mechanical design and product reliability potentially