DocumentCode :
2870251
Title :
Current Status and Future Trends of Electronic Packaging in Automotive Applications
Author :
Minorikawa, Hitoshi ; Sawa, S.S.
Author_Institution :
Sawa Works, Hitachi, Ltd.
fYear :
1990
fDate :
1990
Firstpage :
155
Lastpage :
163
Keywords :
Automotive applications; Control systems; Electronic packaging thermal management; Electronics packaging; Engines; Fuels; Surface-mount technology; Thermal stresses; Vehicles; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transportation Electronics, 1990. Vehicle Electronics in the 90's: Proceedings of the International Congress on
Print_ISBN :
1-56091-047-X
Type :
conf
DOI :
10.1109/ICTE.1990.713007
Filename :
713007
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2870251
بازگشت