DocumentCode
2870756
Title
Phase-Tolerant Latency Control for a Combination 512Mb 2.0Gb/s/pin GDDR3 and 2.5Gb/s/pin GDDR4 SDRAM
Author
Johnson, Brian ; Keeth, Brent ; Lin, Feng ; Zheng, Hua
Author_Institution
Micron Technol., Boise, ID
fYear
2007
fDate
11-15 Feb. 2007
Firstpage
494
Lastpage
617
Abstract
A 512Mb graphics DRAM device uses phase-tolerant read and write latency control to achieve 2Gb/s/pin GDDR3 and 2.5G/ps/pin GDDR4 operation. The IC is implemented in a 95nm 1.5V triple metal CMOS process.
Keywords
CMOS integrated circuits; DRAM chips; 1.5 V; 512 Mbit; 95 nm; DRAM device; GDDR3 SDRAM; GDDR4 SDRAM; integrated circuit implementation; phase-tolerant latency control; read and write latency control; triple metal CMOS process; Clocks; Control systems; Counting circuits; Decoding; Delay; Random access memory; Reflective binary codes; SDRAM; Synchronization; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2007. ISSCC 2007. Digest of Technical Papers. IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
1-4244-0853-9
Electronic_ISBN
0193-6530
Type
conf
DOI
10.1109/ISSCC.2007.373510
Filename
4242481
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