DocumentCode :
2871851
Title :
Direct measurement technique of strain in XRD tensile test for evaluating Poisson´s ratio of micron-thick TiN films
Author :
Namazu, Takahiro ; Inoue, Shozo ; Ano, Daisuke ; Koterazawa, Keiji
Author_Institution :
Dept. of Mech. & Syst. Eng., Himeji Inst. of Technol., Hyogo, Japan
fYear :
2004
fDate :
2004
Firstpage :
157
Lastpage :
160
Abstract :
This paper presents a novel strain measurement technique for determining Poisson´s ratio of micron-thick polycrystalline TiN films. We developed a new compact tensile tester operating with X-ray diffraction (XRD) equipment in order to evaluate Young´s modulus, Poisson´s ratio and fracture strength of TiN films. TiN films having the thickness between 1.5 μm and 2.0 μm were deposited onto 9 μm or 24 μm-thick single crystal silicon (SCS) specimen by rf reactive magnetron sputtering. Young´s moduli of TiN films deposited at Ar pressure of 0.7 Pa and 0.9 Pa were found to be 290 GPa and 240 GPa, respectively. Poisson´s ratios of the films were, for the first time, determined to be 0.36 and 0.27 by out-of-plane normal strain measurements using XRD during tensile tests. The change in the mechanical properties of TiN films with Ar pressure should be attributed to the change in the film density. This technique proposed can be useful for accurately measuring Poisson´s ratio of micron-thick single- and poly-crystalline MEMS films.
Keywords :
Poisson ratio; X-ray diffraction; Young´s modulus; micromechanical devices; sputtered coatings; strain measurement; tensile testing; thin films; titanium compounds; 0.7 Pa; 0.9 Pa; 1.5 to 2.0 micron; 24 micron; 9 micron; Poisson ratio; TiN; X-ray diffraction; XRD equipment; XRD tensile test; Young´s moduli; microelectromechanical systems; micron thick polycrystalline TiN films; micron thick single MEMS films; polycrystalline MEMS films; reactive magnetron sputtering; single crystal silicon; strain measurement; Argon; Measurement techniques; Semiconductor films; Silicon; Strain measurement; Tensile strain; Testing; Tin; X-ray diffraction; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
Print_ISBN :
0-7803-8265-X
Type :
conf
DOI :
10.1109/MEMS.2004.1290546
Filename :
1290546
Link To Document :
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