• DocumentCode
    2871851
  • Title

    Direct measurement technique of strain in XRD tensile test for evaluating Poisson´s ratio of micron-thick TiN films

  • Author

    Namazu, Takahiro ; Inoue, Shozo ; Ano, Daisuke ; Koterazawa, Keiji

  • Author_Institution
    Dept. of Mech. & Syst. Eng., Himeji Inst. of Technol., Hyogo, Japan
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    157
  • Lastpage
    160
  • Abstract
    This paper presents a novel strain measurement technique for determining Poisson´s ratio of micron-thick polycrystalline TiN films. We developed a new compact tensile tester operating with X-ray diffraction (XRD) equipment in order to evaluate Young´s modulus, Poisson´s ratio and fracture strength of TiN films. TiN films having the thickness between 1.5 μm and 2.0 μm were deposited onto 9 μm or 24 μm-thick single crystal silicon (SCS) specimen by rf reactive magnetron sputtering. Young´s moduli of TiN films deposited at Ar pressure of 0.7 Pa and 0.9 Pa were found to be 290 GPa and 240 GPa, respectively. Poisson´s ratios of the films were, for the first time, determined to be 0.36 and 0.27 by out-of-plane normal strain measurements using XRD during tensile tests. The change in the mechanical properties of TiN films with Ar pressure should be attributed to the change in the film density. This technique proposed can be useful for accurately measuring Poisson´s ratio of micron-thick single- and poly-crystalline MEMS films.
  • Keywords
    Poisson ratio; X-ray diffraction; Young´s modulus; micromechanical devices; sputtered coatings; strain measurement; tensile testing; thin films; titanium compounds; 0.7 Pa; 0.9 Pa; 1.5 to 2.0 micron; 24 micron; 9 micron; Poisson ratio; TiN; X-ray diffraction; XRD equipment; XRD tensile test; Young´s moduli; microelectromechanical systems; micron thick polycrystalline TiN films; micron thick single MEMS films; polycrystalline MEMS films; reactive magnetron sputtering; single crystal silicon; strain measurement; Argon; Measurement techniques; Semiconductor films; Silicon; Strain measurement; Tensile strain; Testing; Tin; X-ray diffraction; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
  • Print_ISBN
    0-7803-8265-X
  • Type

    conf

  • DOI
    10.1109/MEMS.2004.1290546
  • Filename
    1290546