Title :
Synthesis and characterization of corona-resistant polyimide/silica and alumina hybrid films
Author :
Zhou, Hong ; Fan, Yong ; Lei, Qingquan
Author_Institution :
Coll. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol.
Abstract :
A new class of polyimide hybrid films with various amounts of silica and alumina has been synthesized by the sol-gel reaction and characterized. The hybrid films were obtained by the hydrolysis and polycondensation of heteropropyl-alumina and tetraethoxysilane (TEOS) in a polyamic acid (PAA) solution of N,N´-dimethylacetamide (DMAc), followed by heating to 350degC. The chemical structure and surface morphology of the composites films were characterized by Fourier transform infrared spectroscopy (FTIR) and atomic force microscopy (AFM). The thermal stability of the composite films was tested on a Perkin-Elmer TGA7. Thermal stability of the hybrid film was increased with the nano scale inorganic oxides. The presence of silica and alumina has a significant effect on the properties of polyimide films
Keywords :
Fourier transform spectroscopy; atomic force microscopy; chemical structure; corona; infrared spectroscopy; organic-inorganic hybrid materials; polymer films; sol-gel processing; surface morphology; thermal stability; 350 C; Fourier transform infrared spectroscopy; Perkin-Elmer TGA7; atomic force microscopy; chemical structure; composites film; corona-resistant film; dimethylacetamide; heteropropyl-alumina; hydrolysis; nano scale inorganic oxide; polyamic acid solution; polycondensation; polyimide-silica-alumina hybrid film; sol-gel reaction; surface morphology; tetraethoxysilane; thermal stability; Atomic force microscopy; Chemicals; Fourier transforms; Heating; Infrared spectra; Polyimides; Silicon compounds; Surface morphology; Testing; Thermal stability;
Conference_Titel :
Electrical Insulation Conference and Electrical Manufacturing Expo, 2005. Proceedings
Conference_Location :
Indianapolis, IN
Print_ISBN :
0-7803-9145-4
DOI :
10.1109/EEIC.2005.1566284
