• DocumentCode
    2872239
  • Title

    University-company partnerships key to resolving outsourcing of U.S. jobs

  • Author

    Erwin, Gary J.

  • Author_Institution
    Kettering Univ., Flint, MI
  • fYear
    2005
  • fDate
    26-26 Oct. 2005
  • Firstpage
    258
  • Lastpage
    262
  • Abstract
    Many analysts believe that industry-university partnerships in the U.S. similar to those between the Electrical Manufacturing and Coil Winding Association and American universities could help the U.S. electrical manufacturing industry recover from the loss of jobs overseas through the development of new innovations. Unfortunately, media outlets often fail to provide a balanced view of the outsourcing issue for many industries including the electrical and electronics manufacturing industry, thus creating public uncertainty regarding the import and export of U.S. jobs. This paper summarizes some of the outsourcing issues in the industry today, provides insights into how the electrical and electronics manufacturing industry could re-establish itself through relationships with institutions of higher education, and attempts to decipher the real story of outsourcing that our national media fails to report
  • Keywords
    educational institutions; electrical products industry; electronics industry; international trade; outsourcing; patents; North American Free Trade Agreement; US; coil winding association; contracting; education institution; electrical-electronics manufacturing industry; exports; imports; innovation development; national media; outsourcing jobs; patent infringement; university-company partnership; workforce development; Automotive engineering; Coils; Consumer electronics; Electronics industry; Industrial electronics; Industrial relations; Manufacturing industries; Outsourcing; Production; Trade agreements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference and Electrical Manufacturing Expo, 2005. Proceedings
  • Conference_Location
    Indianapolis, IN
  • Print_ISBN
    0-7803-9145-4
  • Type

    conf

  • DOI
    10.1109/EEIC.2005.1566303
  • Filename
    1566303