Title :
HIGH-DENSITY CMOS MULTICHIP-MODULE TESTING AND DIAGNOSIS
Author :
Bassett, Robert W. ; Gillis, Pamela S. ; Shushereba, John J.
Keywords :
Assembly; CMOS logic circuits; CMOS memory circuits; CMOS technology; Circuit testing; Electronic packaging thermal management; Electronics packaging; Logic circuits; Pins; System performance;
Conference_Titel :
Test Conference, 1991, Proceedings., International
Print_ISBN :
0-8186-9156-5
DOI :
10.1109/TEST.1991.519715
