Title :
Packaging for VLSI components
Author_Institution :
IBM Corp., Hopwell Junction, NY, USA
Abstract :
Summary form only given. Most of the semiconductor industry is envisioning the day in the not-too-distant future when silicon parts will be an order of magnitude more complex than today??s LSI parts. The application of these complex parts will be in a variety of areas, some of which will be extensions of today??s applications, such as computer systems, communication and control. New uses will also immerge, possible only because of these new components. We are seeing the beginning of these applications in consumer products such as games and also in the transportation industry in automotive applications. Perhaps the most extensive application of these VLSl parts has not yet even emerged.
Keywords :
Bonding; Circuits; Consumer products; Costs; Electronic packaging thermal management; Electronics packaging; Large scale integration; Silicon; Toy industry; Very large scale integration;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1981 IEEE International
Conference_Location :
New York, NY, USA
DOI :
10.1109/ISSCC.1981.1156263