• DocumentCode
    2872909
  • Title

    Packaging for VLSI components

  • Author

    Joy, R.

  • Author_Institution
    IBM Corp., Hopwell Junction, NY, USA
  • Volume
    XXIV
  • fYear
    1981
  • fDate
    18-20 Feb. 1981
  • Firstpage
    198
  • Lastpage
    199
  • Abstract
    Summary form only given. Most of the semiconductor industry is envisioning the day in the not-too-distant future when silicon parts will be an order of magnitude more complex than today??s LSI parts. The application of these complex parts will be in a variety of areas, some of which will be extensions of today??s applications, such as computer systems, communication and control. New uses will also immerge, possible only because of these new components. We are seeing the beginning of these applications in consumer products such as games and also in the transportation industry in automotive applications. Perhaps the most extensive application of these VLSl parts has not yet even emerged.
  • Keywords
    Bonding; Circuits; Consumer products; Costs; Electronic packaging thermal management; Electronics packaging; Large scale integration; Silicon; Toy industry; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference. Digest of Technical Papers. 1981 IEEE International
  • Conference_Location
    New York, NY, USA
  • Type

    conf

  • DOI
    10.1109/ISSCC.1981.1156263
  • Filename
    1156263