Comparative studies on interconnect techniques for RF applications

Author

Yu, Yang ; Jian, Cai ; Shuidi, Wang ; Songliang, Jia

Author_Institution

Inst. of Microelectron., Tsinghua Univ., Beijing, China

fYear

2004

fDate

18-21 Aug. 2004

Firstpage

574

Lastpage

577

Abstract

Interconnect techniques of wire bonding and flip chip are studied with their extracted lumped circuit models in this paper. With relatively complete considerations, they show similar electrical performance in RF range. The models are also applied to a RF-MEMS VCO design, flip chip exists better characteristics as chip-to-chip interconnect inside the package.

Keywords

chip scale packaging; flip-chip devices; integrated circuit interconnections; lead bonding; lumped parameter networks; radiofrequency integrated circuits; RF applications; RF-MEMS VCO design; chip-to-chip interconnect; extracted lumped circuit models; flip chip; interconnect techniques; wire bonding; Bonding; Circuit simulation; Flip chip; Integrated circuit interconnections; Packaging; Radio frequency; Radiofrequency microelectromechanical systems; Voltage-controlled oscillators; Wire; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology, 2004. ICMMT 4th International Conference on, Proceedings

Print_ISBN

0-7803-8401-6

Type

conf

DOI

10.1109/ICMMT.2004.1411594

Filename

1411594

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2872912