Title :
Technology for manufacture of integrated planar LC structures for power electronic applications
Author :
Smit, M.C. ; Ferreira, J.A. ; van Wyk, J.D. ; Ehsani, M.
Author_Institution :
Rand Afrikaans Univ., Johannesburg, South Africa
Abstract :
A new approach to the manufacture of electromagnetic integrated reactive components is presented. In this paper an analysis based on transmission line equations is applied to the planar LC structures and a complete thermal analysis is included. Details of practical technology for integrated planar LC structures operating at high power levels are presented
Keywords :
electromagnetic devices; ferrite applications; losses; packaging; power electronics; power integrated circuits; thermal analysis; transmission line theory; DC conduction losses; capacitance; electromagnetic integrated reactive components; inductance; integrated planar LC structures; manufacture; power electronic applications; thermal analysis; transmission line equations;
Conference_Titel :
Power Electronics and Applications, 1993., Fifth European Conference on
Conference_Location :
Brighton
