DocumentCode
2873263
Title
Fabrication of self-supporting polysilicon thermopile
Author
Yajima, Masakazu ; Toriyama, Toshiyuki ; Sugiyama, Susumu ; Fukumasu, Keiichirou ; Konishi, Satoshi
Author_Institution
Fac. of Sci. & Eng., Ritsumeikan Univ., Kyoto, Japan
fYear
2000
fDate
2000
Firstpage
237
Lastpage
241
Abstract
A prototype self-supporting polysilicon-metal junction thermopile has been developed. In order to realize ideal higher thermal isolation, a thermopile without a membrane and having self-supporting structure is proposed. The hot and cold contacts in the proposed thermopile are reversible. The thermopile can be widely used for sensing elements of power generators, temperature sensors, radiation sensors, flow sensors, and so on. The thermocouple is composed of polysilicon and Au junction. The thermopile was fabricated by MICS (Micromachine Integrated Chip Service: three polysilicon layers structure). Outputs were measured as a function of distance between hot contact of the thermopile and the radiation source. In order to confirm performance of the thermopile, the output voltages were compared with theoretical values. The experimental results were in good agreement with the calculations
Keywords
Seebeck effect; elemental semiconductors; etching; micromachining; microsensors; silicon; temperature sensors; thermoelectric conversion; thermopiles; Seebeck effect; Si; Si-Au; cold contacts; flow sensors; hot contacts; ideal higher thermal isolation; micromachine integrated chip service; output voltages; polysilicon-metal junction thermopile; radiation sensors; reversible contacts; self-supporting polysilicon thermopile; sensing elements; temperature sensors; thermoelectric power generators; Biomembranes; Fabrication; Gold; Microwave integrated circuits; Power generation; Prototypes; Semiconductor device measurement; Temperature sensors; Thermal sensors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Micromechatronics and Human Science, 2000. MHS 2000. Proceedings of 2000 International Symposium on
Conference_Location
Nagoya
Print_ISBN
0-7803-6498-8
Type
conf
DOI
10.1109/MHS.2000.903332
Filename
903332
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