Thermal modeling for electrothermal simulation of power devices or circuits

To perform electrothermal simulation of power devices or circuits, the authors have developed specific thermal simulation tools which only require limited computational time and effort. 3D and transient flow spreading effects in multilayered substrates commonly used in power component packaging as well as in hybrid power circuits are considered. The authors recall the essentials of 3D transient thermal modeling and show how the thermal responses can be made compatible with a general purpose electrical circuit simulator. The concepts are illustrated by carrying out the electrothermal behaviour simulation of a six-chip power VDMOS transistor module