DocumentCode :
2873537
Title :
A micromachined Pirani gauge with dual heat sinks
Author :
Chae, Junseok ; Stark, Brian H. ; Najafi, Khalil
Author_Institution :
Center for Wireless Integrated Microsyst., Michigan Univ., Ann Arbor, MI, USA
fYear :
2004
fDate :
2004
Firstpage :
532
Lastpage :
535
Abstract :
This paper reports a micromachined Pirani gauge with dual heat sinks, which can be integrated with MEMS devices inside a vacuum package to monitor long-term pressure changes and stability inside the package. The gauge utilizes small gaps (<1 μm) between its heater and two thermal sinks to obtain large dynamic range (20 mTorr to 2 Torr) and high sensitivity (3.5×105 (K/W)/Torr). This gauge can resolve leak rates inside a small sealed cavity as low as 3×10-16 cm3/sec.
Keywords :
electronics packaging; heat sinks; microsensors; pressure measurement; pressure sensors; sensitivity; vacuum gauges; 20 mtorr to 2 torr; MEMS devices; heat sinks; heater; micromachined Pirani gauge; pressure sensors; sensitivity; thermal sinks; vacuum package; Dynamic range; Electronic packaging thermal management; Heat sinks; Heat transfer; Microelectromechanical devices; Sensor phenomena and characterization; Solids; Testing; Thermal conductivity; Vacuum technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
Print_ISBN :
0-7803-8265-X
Type :
conf
DOI :
10.1109/MEMS.2004.1290639
Filename :
1290639
Link To Document :
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