DocumentCode
2873728
Title
Design Considerations for Millimeter Wave Antennas within a Chip Package
Author
Liu, D. ; Gaucher, B.
Author_Institution
T.J. Watson Res. Center, IBM, Yorktown Heights, NY
fYear
2007
fDate
16-18 April 2007
Firstpage
13
Lastpage
17
Abstract
Millimeter wave (mmWave) antennas designed for package integration are significantly more challenging than antenna designs for frequencies below 10 GHz. In addition to wide impedance bandwidth, high efficiency and small size, one has to consider material selection, manufacturing precision, antenna feed line and connections, and electromagnetic interference to the active RF circuits nearby.
Keywords
antenna feeds; electromagnetic interference; millimetre wave antennas; active RF circuits; antenna feed line; chip package; electromagnetic interference; millimeter wave antennas; package integration; wide impedance bandwidth; Antenna feeds; Circuits; Coplanar waveguides; Electronics packaging; Frequency; Impedance; Millimeter wave technology; Semiconductor device packaging; Silicon compounds; Substrates; EMI; flip-attachment; integrated antenna; interconnect; manufacturing precision; package;
fLanguage
English
Publisher
ieee
Conference_Titel
Anti-counterfeiting, Security, Identification, 2007 IEEE International Workshop on
Conference_Location
Xiamen, Fujian
Print_ISBN
1-4244-1035-5
Electronic_ISBN
1-4244-1035-5
Type
conf
DOI
10.1109/IWASID.2007.373685
Filename
4244771
Link To Document