Title :
Design Considerations for Millimeter Wave Antennas within a Chip Package
Author :
Liu, D. ; Gaucher, B.
Author_Institution :
T.J. Watson Res. Center, IBM, Yorktown Heights, NY
Abstract :
Millimeter wave (mmWave) antennas designed for package integration are significantly more challenging than antenna designs for frequencies below 10 GHz. In addition to wide impedance bandwidth, high efficiency and small size, one has to consider material selection, manufacturing precision, antenna feed line and connections, and electromagnetic interference to the active RF circuits nearby.
Keywords :
antenna feeds; electromagnetic interference; millimetre wave antennas; active RF circuits; antenna feed line; chip package; electromagnetic interference; millimeter wave antennas; package integration; wide impedance bandwidth; Antenna feeds; Circuits; Coplanar waveguides; Electronics packaging; Frequency; Impedance; Millimeter wave technology; Semiconductor device packaging; Silicon compounds; Substrates; EMI; flip-attachment; integrated antenna; interconnect; manufacturing precision; package;
Conference_Titel :
Anti-counterfeiting, Security, Identification, 2007 IEEE International Workshop on
Conference_Location :
Xiamen, Fujian
Print_ISBN :
1-4244-1035-5
Electronic_ISBN :
1-4244-1035-5
DOI :
10.1109/IWASID.2007.373685
