• DocumentCode
    2873833
  • Title

    High performance RF power GaN FET technology for microwave power applications

  • Author

    Miyamoto, H. ; Ando, Y. ; Okamoto, Y. ; Inoue, T. ; Nakayama, T. ; Hataya, K. ; Senda, M. ; Hirata, K. ; Kosaki, M. ; Shibata, N. ; Kuzuhara, M.

  • fYear
    2004
  • fDate
    26-28 July 2004
  • Firstpage
    49
  • Lastpage
    50
  • Abstract
    Gallium nitride (GaN) is attracting considerable attention for microwave high-power transistor material as presented in W. L. Pribble et al. (2002), K. Joshin et al. (2003), Y. Okamoto et al. (2004), Y.-F. Wu et al. (2003) and M. Kuzuhara (2003). This is due to its unique material properties, including a wide bandgap leading to high-breakdown fields, a large high-field electron drift velocity leading to high speed, and the existence of polarization effects leading to high sheet charge density that exceeds 1013cm-2. In this paper, recent progress of GaN FET technology for microwave power applications is described.
  • Keywords
    III-V semiconductors; gallium compounds; microwave field effect transistors; power field effect transistors; wide band gap semiconductors; GaN; high-field electron drift velocity; material properties; microwave high-power transistor material; microwave power applications; polarization effects; power FET technology; sheet charge density; wide bandgap materials; Electron mobility; Gallium nitride; III-V semiconductor materials; Material properties; Microwave FETs; Microwave technology; Microwave transistors; Photonic band gap; Polarization; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future of Electron Devices, 2004. International Meeting for
  • Print_ISBN
    0-7803-8423-7
  • Electronic_ISBN
    0-7803-8424-5
  • Type

    conf

  • DOI
    10.1109/IMFEDK.2004.1566402
  • Filename
    1566402