DocumentCode :
2873833
Title :
High performance RF power GaN FET technology for microwave power applications
Author :
Miyamoto, H. ; Ando, Y. ; Okamoto, Y. ; Inoue, T. ; Nakayama, T. ; Hataya, K. ; Senda, M. ; Hirata, K. ; Kosaki, M. ; Shibata, N. ; Kuzuhara, M.
fYear :
2004
fDate :
26-28 July 2004
Firstpage :
49
Lastpage :
50
Abstract :
Gallium nitride (GaN) is attracting considerable attention for microwave high-power transistor material as presented in W. L. Pribble et al. (2002), K. Joshin et al. (2003), Y. Okamoto et al. (2004), Y.-F. Wu et al. (2003) and M. Kuzuhara (2003). This is due to its unique material properties, including a wide bandgap leading to high-breakdown fields, a large high-field electron drift velocity leading to high speed, and the existence of polarization effects leading to high sheet charge density that exceeds 1013cm-2. In this paper, recent progress of GaN FET technology for microwave power applications is described.
Keywords :
III-V semiconductors; gallium compounds; microwave field effect transistors; power field effect transistors; wide band gap semiconductors; GaN; high-field electron drift velocity; material properties; microwave high-power transistor material; microwave power applications; polarization effects; power FET technology; sheet charge density; wide bandgap materials; Electron mobility; Gallium nitride; III-V semiconductor materials; Material properties; Microwave FETs; Microwave technology; Microwave transistors; Photonic band gap; Polarization; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Future of Electron Devices, 2004. International Meeting for
Print_ISBN :
0-7803-8423-7
Electronic_ISBN :
0-7803-8424-5
Type :
conf
DOI :
10.1109/IMFEDK.2004.1566402
Filename :
1566402
Link To Document :
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