DocumentCode :
2874216
Title :
Effect of breakdown in ultrathin gate oxides on channel current
Author :
Hosoi, H. ; Kamakura, Y. ; Taniguchi, K.
Author_Institution :
Dept. of Electron. & Inf. Syst., Osaka Univ., Japan
fYear :
2004
fDate :
26-28 July 2004
Firstpage :
91
Lastpage :
92
Abstract :
Channel current degradation of small MOSFETs after the occurrence of breakdown in ultrathin gate oxides is investigated (Cester et al., 2003). The channel current reduction induced by the breakdown is observed even after eliminating two possible components, i.e., (1) the threshold voltage shift and the mobility degradation due to the interface trap generation, and (2) the flow of the gate leakage current into the drain terminal (Rodriguez et al., 2002). We suppose that the local modulation of the surface potential near the breakdown spot prevents the carrier conduction, and a new model is proposed to interpret the gate width and the gate voltage dependence of the channel current degradation.
Keywords :
MOSFET; semiconductor device breakdown; semiconductor device models; MOSFET; carrier conduction; channel current degradation; gate leakage current; interface trap generation; mobility degradation; surface potential; threshold voltage shift; ultrathin gate oxides breakdown; Breakdown voltage; Degradation; Electric breakdown; Equivalent circuits; Information systems; Leakage current; MOSFETs; Monitoring; Stress; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Future of Electron Devices, 2004. International Meeting for
Print_ISBN :
0-7803-8423-7
Electronic_ISBN :
0-7803-8424-5
Type :
conf
DOI :
10.1109/IMFEDK.2004.1566423
Filename :
1566423
Link To Document :
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