• DocumentCode
    2874216
  • Title

    Effect of breakdown in ultrathin gate oxides on channel current

  • Author

    Hosoi, H. ; Kamakura, Y. ; Taniguchi, K.

  • Author_Institution
    Dept. of Electron. & Inf. Syst., Osaka Univ., Japan
  • fYear
    2004
  • fDate
    26-28 July 2004
  • Firstpage
    91
  • Lastpage
    92
  • Abstract
    Channel current degradation of small MOSFETs after the occurrence of breakdown in ultrathin gate oxides is investigated (Cester et al., 2003). The channel current reduction induced by the breakdown is observed even after eliminating two possible components, i.e., (1) the threshold voltage shift and the mobility degradation due to the interface trap generation, and (2) the flow of the gate leakage current into the drain terminal (Rodriguez et al., 2002). We suppose that the local modulation of the surface potential near the breakdown spot prevents the carrier conduction, and a new model is proposed to interpret the gate width and the gate voltage dependence of the channel current degradation.
  • Keywords
    MOSFET; semiconductor device breakdown; semiconductor device models; MOSFET; carrier conduction; channel current degradation; gate leakage current; interface trap generation; mobility degradation; surface potential; threshold voltage shift; ultrathin gate oxides breakdown; Breakdown voltage; Degradation; Electric breakdown; Equivalent circuits; Information systems; Leakage current; MOSFETs; Monitoring; Stress; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Future of Electron Devices, 2004. International Meeting for
  • Print_ISBN
    0-7803-8423-7
  • Electronic_ISBN
    0-7803-8424-5
  • Type

    conf

  • DOI
    10.1109/IMFEDK.2004.1566423
  • Filename
    1566423