• DocumentCode
    2874381
  • Title

    Ceramic microcomponents by microstereolithography

  • Author

    Bertsch, A. ; Jiguet, S. ; Hofmann, H. ; Renaud, P.

  • Author_Institution
    IMM, Swiss Fed. Inst. of Technol., Lausanne, Switzerland
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    725
  • Lastpage
    728
  • Abstract
    This paper describes new polymer/ceramic photosensitive resins that can be used in the microstereolithography process for manufacturing complex 3D components in composite material. These new resins contain high loads (up to 80 wt.%) of alumina nanoparticles, used as fillers in a photosensitive acrylate-based resin of low viscosity. With the nanopowder-filled resin we developed, various small polymer/alumina composite components having a real geometric complexity were produced with small manufacturing times. When using a reactive medium containing a high enough percentage of ceramic nanoparticles, no deformation or cracks are observed after debinding and sintering, even if some shrinkage occurs during these steps. This process makes it possible to manufacture a new set of micro-components in ceramic material that could be of interest for high-temperature micro-reaction technologies, or for the production of new components in the biomedical domain.
  • Keywords
    alumina; ceramics; filled polymers; nanocomposites; nanoparticles; resins; sintering; stereolithography; Al2O3; alumina nanoparticles; ceramic material; ceramic microcomponent; ceramic nanoparticles; composite material; fillers; high temperature microreaction technologies; microstereolithography; photosensitive acrylate based resin; polymer/ceramic photosensitive resins; sintering; viscosity; Biological materials; Ceramics; Composite materials; Manufacturing processes; Nanocomposites; Nanoparticles; Polymers; Pulp manufacturing; Resins; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
  • Print_ISBN
    0-7803-8265-X
  • Type

    conf

  • DOI
    10.1109/MEMS.2004.1290687
  • Filename
    1290687