DocumentCode
2874586
Title
Thin bonded wafer SOI CMOS technology for low voltage high performance applications
Author
Nowak, E.D. ; Ding, L. ; Loh, Y.T. ; Hu, C.
Author_Institution
University of California
fYear
1994
fDate
1994
Firstpage
38566
Lastpage
39662
Keywords
CMOS process; CMOS technology; Circuit optimization; Delay effects; Low voltage; MOSFET circuits; Semiconductor films; Silicon on insulator technology; Threshold voltage; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International
Type
conf
DOI
10.1109/EDMS.1994.771270
Filename
771270
Link To Document