DocumentCode

2874590

Title

New metal structure by sidewall encapsulation method

Author

Kim, Eungsoo ; Shim, Sang-Chul ; Cho, Kyung-Won ; Lim, Soon-Kwon ; Choi, Kyu-hyun

Author_Institution

Samsung Electronics Co., Ltd.

fYear

1994

fDate

1994

Firstpage

40028

Lastpage

41124

Keywords

Artificial intelligence; Degradation; Encapsulation; Etching; Intermetallic; Samarium; Scanning electron microscopy; Temperature; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International

Type

conf

DOI

10.1109/EDMS.1994.771271

Filename

771271