Packaging technology for microwave ICs and high speed logic

The problems of packaging for high-speed logic and microwave ICs have much in common. The issues of circuit partitioning, propagation delay, circuit density, power dissipation, testing and service are as appropriate to microwaves as to high performance computers . . . The number of technical approaches to these problems has grown with the evolution of semiconductor and packaging technologies . . . This panel will review the latest developments in the field from a variety of industries and seek common ground among these. Focus will be on realizable systems of today, plus a view to emerging technology.