Title :
Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.05CH37651)
Abstract :
The following topics are dealt with: advanced liquid cooling; thermal interface materials; system level cooling; air cooling; temperature effects on performance and reliability; nanoscale and microscale thermal solutions; nanoscale thermal characterization techniques; stacked die packages; liquid cooling enablers; thermal analysis.
Keywords :
cooling; nanoelectronics; semiconductor device reliability; thermal analysis; thermal management (packaging); advanced liquid cooling; air cooling; liquid cooling enablers; microscale thermal solutions; nanoscale thermal characterization techniques; nanoscale thermal solutions; reliability; semiconductor thermal management; semiconductor thermal measurement; stacked die; system level cooling; temperature effects; thermal analysis; thermal interface materials;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412141
