A practical implementation of silicon microchannel coolers for high power chips

Author

Colgan, E.G. ; Furman, B. ; Graham, W. ; LaBianca, N. ; Magerlein, J.H. ; Polastre, R.J. ; Rothwell, M.B. ; Bezama, R.J. ; Choudhary, Ruchika ; Marston, Kenneth ; Toy, H. ; Wakil, J. ; Zitz, Jeffrey

Author_Institution

IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

2005

fDate

15-17 March 2005

Firstpage

1

Lastpage

7

Abstract

The paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance of 10.5 C-mm²/W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of less than 35 kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm². Coolers of this design should be able to cool chips with average power densities of 400 W/cm² or more.

Keywords

cooling; heat exchangers; integrated circuit packaging; modules; monolithic integrated circuits; power semiconductor devices; silicon; thermal resistance; Si; chip power density; cooler fin designs; fluid pressure drop; high power chips; microprocessors; multiple heat exchanger zones; silicon microchannel coolers; single chip module; thermal resistance; Cooling; Design optimization; Microchannel; Microprocessors; Resistance heating; Silicon; Surface resistance; Testing; Thermal resistance; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-8985-9

Type

conf

DOI

10.1109/STHERM.2005.1412151

Filename

1412151