DocumentCode
2875427
Title
Development of an instrumented glass microchannel device for critical heat flux visualization and studies [IC cooling applications]
Author
Jain, Abhishek ; Borca-Tasciuc, Theodorian ; Roday, Anand P. ; Jensen, Michael K. ; Kandlikar, Satish G.
Author_Institution
Dept. of Mech., Aerosp. & Nucl. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
fYear
2005
fDate
15-17 March 2005
Firstpage
26
Lastpage
30
Abstract
Boiling in microchannels is an important candidate for cooling of electronic chips. A crucially important factor in the design of microchannel boiling heat transfer is the critical heat flux (CHF). This work presents the development of a glass microchannel device for quantitative investigations of CHF and visualization of boiling phenomena at microscale. The device is instrumented with heaters and temperature sensors to map the temperature distribution in the axial direction. The use of low thermal conductivity glass reduces the heat conduction losses, and improves the accuracy of CHF values extracted from experimental results. This work presents the fabrication and packaging of a single microchannel device.
Keywords
boiling; cooling; integrated circuit packaging; microfluidics; temperature distribution; temperature sensors; CHF; IC cooling; axial direction temperature distribution; critical heat flux visualization; heaters; instrumented glass microchannel device; low thermal conductivity glass; microchannel boiling heat transfer; microfabrication; microscale boiling phenomena; temperature sensors; Application specific integrated circuits; Electronics cooling; Glass; Heat transfer; Instruments; Microchannel; Temperature distribution; Temperature sensors; Thermal conductivity; Visualization;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-8985-9
Type
conf
DOI
10.1109/STHERM.2005.1412155
Filename
1412155
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