Evaluation of high performance thermal greases for CPU package cooling applications

Author

Stern, Margaret B. ; Gektin, Vadim ; Pecavar, Stanley ; Kearns, Donald ; Chen, Tony

Author_Institution

Sun Microsystems, Inc, San Diego, CA, USA

fYear

2005

fDate

15-17 March 2005

Firstpage

39

Lastpage

43

Abstract

High performance thermal greases have been evaluated in three separate environments: ideal laboratory, in situ laboratory, and system mockup testing to better understand how bulk and interfacial thermal properties, in combination with the test vehicles used, effect the resultant thermal performance. The three methodologies are described and measurements on a baseline material reported.

Keywords

cooling; greases; integrated circuit packaging; thermal conductivity; thermal management (packaging); thermal resistance; BLT; CPU package cooling; TIM; bondline thickness; bulk thermal properties; high performance thermal greases; interfacial thermal properties; thermal characterization; thermal conductivity; thermal interface material; thermal resistance; Conducting materials; Cooling; Electrical resistance measurement; Electronic packaging thermal management; Laboratories; Surface resistance; System testing; Thermal conductivity; Thermal resistance; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-8985-9

Type

conf

DOI

10.1109/STHERM.2005.1412157

Filename

1412157