DocumentCode
2875554
Title
Rudimentary finite element thermal modeling of platelet-filled polymer-ceramic composites
Author
Hill, Richard F. ; Strader, Jason L.
Author_Institution
Div. of Laird Technol., Thermagon, Inc, Cleveland, OH, USA
fYear
2005
fDate
15-17 March 2005
Firstpage
72
Lastpage
77
Abstract
In order to improve the thermal performance of polymeric materials, they can be filled with intrinsically high thermal conductivity fillers that provide heat-conducting paths through the resulting composite. The thermal performance of polymers loaded with platelet-shaped fillers was modeled using finite element analysis in order to provide a prediction of thermal conductivity as a function of variables such as filler thermal conductivity, orientation, and polymer matrix thermal conductivity. Modeling results were compared to experimental data. An unexpectedly strong effect that the matrix conductivity has on the conductivity of the polymer-ceramic composite was predicted by modeling and confirmed experimentally.
Keywords
ceramics; filled polymers; finite element analysis; thermal conductivity; ceramic-filled polymer composites; filler orientation; filler thermal conductivity; finite element thermal modeling; heat-conducting paths; platelet-shaped fillers; polymer matrix thermal conductivity; Conducting materials; Electronic packaging thermal management; Finite element methods; Performance analysis; Polymer films; Predictive models; Thermal conductivity; Thermal factors; Thermal loading; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-8985-9
Type
conf
DOI
10.1109/STHERM.2005.1412161
Filename
1412161
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