• DocumentCode
    2875554
  • Title

    Rudimentary finite element thermal modeling of platelet-filled polymer-ceramic composites

  • Author

    Hill, Richard F. ; Strader, Jason L.

  • Author_Institution
    Div. of Laird Technol., Thermagon, Inc, Cleveland, OH, USA
  • fYear
    2005
  • fDate
    15-17 March 2005
  • Firstpage
    72
  • Lastpage
    77
  • Abstract
    In order to improve the thermal performance of polymeric materials, they can be filled with intrinsically high thermal conductivity fillers that provide heat-conducting paths through the resulting composite. The thermal performance of polymers loaded with platelet-shaped fillers was modeled using finite element analysis in order to provide a prediction of thermal conductivity as a function of variables such as filler thermal conductivity, orientation, and polymer matrix thermal conductivity. Modeling results were compared to experimental data. An unexpectedly strong effect that the matrix conductivity has on the conductivity of the polymer-ceramic composite was predicted by modeling and confirmed experimentally.
  • Keywords
    ceramics; filled polymers; finite element analysis; thermal conductivity; ceramic-filled polymer composites; filler orientation; filler thermal conductivity; finite element thermal modeling; heat-conducting paths; platelet-shaped fillers; polymer matrix thermal conductivity; Conducting materials; Electronic packaging thermal management; Finite element methods; Performance analysis; Polymer films; Predictive models; Thermal conductivity; Thermal factors; Thermal loading; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-8985-9
  • Type

    conf

  • DOI
    10.1109/STHERM.2005.1412161
  • Filename
    1412161