Title :
Thermal characterization of a radial micro-channel cooling plate
Author :
Bognár, Gy ; Horvoth, G. ; Kohari, Zs ; Pang, A.J. ; Desmulliez, M.P.Y. ; Poppe, A. ; Rencz, M. ; Szkely, V.
Author_Institution :
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Hungary
Abstract :
The thermal behavior of a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement has been investigated. The device is to be used in microelectronic packaging cooling applications. In our study it was attached to a power transistor which was used as a dissipator and a temperature sensor. The thermal transient response to a dissipation step of the transistor was recorded in the measurement. The measured transients (cooling curves) were transformed into structure functions from which the partial thermal resistance corresponding to the cooling assembly was identified. The measurement and the partial thermal resistance identification was carried out at different flow-rates of nitrogen gas forced through the micro-channels. This way thermal resistance versus flow-rate and heat-transfer coefficient versus flowrate characteristics of the investigated micro-channel cooler were derived.
Keywords :
cooling; nickel; power transistors; thermal management (packaging); thermal resistance; cooling curves; dissipator; flowrate characteristics; heat-transfer coefficient; microelectronic packaging cooling; nitrogen gas; partial thermal resistance; power transistor; radial micro-channel cooling plate; square nickel plate micro-cooler; structure functions; temperature sensor; thermal characterization; thermal transient response; Assembly; Cooling; Electrical resistance measurement; Microelectronics; Nickel; Packaging; Power transistors; Temperature sensors; Thermal resistance; Transient response;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412169
