Title :
Physical interpretation and numerical approximation of structure functions of components and packages
Author :
Codecasa, Lorenzo ; D´Amore, Dario ; Maffezzoni, Paolo
Author_Institution :
Dipt. di Elettronica e Informazione, Politecnico di Milano, Milan, Italy
Abstract :
A novel relation between the structure functions of one-port passive distributed thermal networks and the spatial distributions of thermal properties in components and package is proved. A novel tridiagonalization approach for approximating the structure functions of one-port distributed lumped thermal networks is also proposed.
Keywords :
thermal management (packaging); thermal properties; components; numerical approximation; one-port distributed lumped thermal networks; one-port passive distributed thermal networks; packages; spatial distributions; structure functions; thermal properties; tridiagonalization approach; Computational geometry; Distributed computing; Electronic mail; Impedance; Packaging; Thermal conductivity; Thermal expansion;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412171
