DocumentCode
2875976
Title
Flat plate loop heat pipe with a novel evaporator structure
Author
Meng-Chang Tsai ; Chun-Sheng Yu ; Shung-Wen Kang
Author_Institution
Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Tamsui, Taiwan
fYear
2005
fDate
15-17 March 2005
Firstpage
187
Lastpage
190
Abstract
The paper proposes the fabrication and test of flat plate loop heat pipe (FPLHP) with a novel evaporator structure. The IC industry of Taiwan, ROC is one of the most competitive industries in the world. With the increase in electric heat dissipation and miniaturization, we need advanced cooling systems to solve the high temperature problems. We describe the evaporator design and a new stretched design. Finally, the test results show that the new design of FPLHP works very well.
Keywords
cooling; evaporation; heat pipes; integrated circuit packaging; microprocessor chips; advanced cooling systems; computer chips; electric heat dissipation; evaporator structure; flat plate loop heat pipe; high temperature problems; miniaturization; Copper; Electronics cooling; Fabrication; Heat engines; Heat sinks; NASA; Refrigeration; Resistance heating; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Conference_Location
San Jose, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-8985-9
Type
conf
DOI
10.1109/STHERM.2005.1412177
Filename
1412177
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