Title :
Thermal characterization of high performance MCP with silicon spacer having low thermal impedance
Author :
Lee, Haehyung ; Park, Sangwook ; Baek, Joonghyun ; Lee, Jinyang ; Lee, Dongho ; Oh, Seyong
Author_Institution :
Samsung Electron. Co., LTD, Gyeonggi-Do, South Korea
Abstract :
This paper presents the thermal optimization of a thermally enhanced FBGA MCP (multichip package). Because of insufficient heat path from top chip to PCB, heat is trapped between chips as shown in computer simulations. To solve the heat trap problem, we designed and developed a thermally enhanced MCP with a silicon spacer, which was applied to a 144 FBGA MCP. An experiment was carried out to verify the thermal characteristics of the thermally enhanced MCP, concerning structural variation and replacement of the adhesive. The experimental results showed that the thermal resistance of the MCP is improved and the low thermal conductive adhesive material is an important heat path barrier.
Keywords :
adhesives; ball grid arrays; circuit optimisation; integrated circuit packaging; thermal management (packaging); thermal resistance; MCP thermal characterization; heat trap; low thermal conductive adhesive; low thermal impedance spacer; silicon spacer; thermal optimization; thermal resistance; thermally enhanced FBGA; top chip/PCB heat path; Computer simulation; Conducting materials; Conductive adhesives; Impedance; Packaging; Resistance heating; Silicon; Space heating; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412199
