DocumentCode :
2876490
Title :
Analytical modeling of electrokinetic effect on thermal transport in electrolytic flow in microchannels
Author :
Jain, Abhishek ; Jensen, Michael K.
Author_Institution :
Dept. of Mech., Aerosp. & Nucl. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
fYear :
2005
fDate :
15-17 March 2005
Firstpage :
341
Lastpage :
346
Abstract :
A fundamental understanding of electrolytic flow in micro and nano channels is essential for the design of microfluidic devices. In this paper, an analytical investigation is carried out to study the behavior of the electrostatic potential developed at the microchannel surface with the electrokinetic distance and zeta potential. The present work also deals with finding an analytical expression for the dimensional and non-dimensional velocity profile. An expression for the CfRe product is derived, based on the non-dimensional velocity profile. The characteristic thickness, which is an indicator of the formation of the electric double layer, varies with the ionic concentration of the electrolyte and this behavior has been plotted for different values of ionic strengths.
Keywords :
Debye-Huckel theory; Navier-Stokes equations; Poisson equation; electrokinetic effects; electrorheology; liquid theory; microfluidics; surface charging; CfRe product; Debye-Huckel parameter; Navier-Stokes equation; Poisson-Boltzmann equation; dimensional velocity profile; electric double layer formation; electro-viscous effect; electrokinetic distance; electrolyte ionic concentration; electrolytic flow; interfacial electrokinetic effect; microchannel fluid flow; microchannel surface electrostatic potential; nanochannels; nondimensional velocity profile; surface charges; thermal transport; zeta potential; Analytical models; Electrokinetics; Electrostatics; Fluid flow; Heat transfer; Microchannel; Microfluidics; Micromechanical devices; Surface charging; Thermal engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
ISSN :
1065-2221
Print_ISBN :
0-7803-8985-9
Type :
conf
DOI :
10.1109/STHERM.2005.1412202
Filename :
1412202
Link To Document :
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