Title :
On-chip liquid cooling with integrated pump technology
Author :
Oprins, H. ; Nicole, C.C.S. ; Baret, J.C. ; Van der Veken, G. ; Lasance, C. ; Baelmans, M.
Author_Institution :
Dept. of Mech. Eng., Katholieke Univ., Leuven, Belgium
Abstract :
In this paper, the capability of a novel cooling system for microchannels based on the principle of electrowetting is examined. To start with, the electrowetting effect in microchannels is experimentally investigated. Next, based upon these results, the cooling capacity of the proposed system is theoretically investigated. It can be concluded that the proposed system is promising, especially when frequencies in the range of a few Hz can be achieved.
Keywords :
cooling; integrated circuit packaging; microfluidics; micropumps; thermal management (packaging); wetting; cooling capacity; electrowetting effect; forced convection microchannel liquid cooling; integrated cooling system; integrated pump technology; microchannel cooling system; on-chip liquid cooling; Dielectric liquids; Electronics cooling; Filling; Heat transfer; Liquid cooling; Microchannel; Silicon; Temperature; Thermal conductivity; Voltage;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412203
