DocumentCode
2876535
Title
Advances in liquid coolant technologies for electronics cooling
Author
Mohapatra, Satish C. ; Loikits, Daniel
Author_Institution
Dynalene Heat Transfer Fluids, Whitehall, PA, USA
fYear
2005
fDate
15-17 March 2005
Firstpage
354
Lastpage
360
Abstract
There are several liquid coolants existing today. Among these, some are based on old technologies and the others are based on new advancements. All these liquids have been divided into six chemistries and a methodology has been presented to compare their overall efficiency, which was determined from heat transfer rate as well as pumping power requirements in microchannels. It was found that potassium formate (PF) solution exhibits the highest overall efficiency among the coolant chemistries evaluated. Other factors such as flammability, toxicity, corrosivity and electrical conductivity have been discussed in reference to these coolants. Based on electrical conductivity, liquid coolants have been divided into three categories: (1) liquid in which direct immersion cooling is possible; (2) liquid in which direct immersion is not possible but a leak or a spill will not damage the electronics; and (3) liquid in which neither direct immersion nor leakage is tolerable.
Keywords
coolants; cooling; electrical conductivity; flammability; microfluidics; organic compounds; potassium compounds; cooling efficiency; corrosivity; direct immersion cooling; electrical conductivity; electronics cooling; flammability; heat transfer fluids; heat transfer rate; liquid chemistries; liquid coolants; microchannel pumping power requirements; potassium formate solution; toxicity; Chemical technology; Chemistry; Conductivity; Coolants; Electronics cooling; Flammability; Heat pumps; Heat transfer; Liquids; Microchannel;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-8985-9
Type
conf
DOI
10.1109/STHERM.2005.1412204
Filename
1412204
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