Title :
Thermal Properties of Tin/Silver Alloy Nanoparticles for Low Temperature Lead-free Interconnect Technology
Author :
Jiang, Hongjin ; Moon, Kyoung-Sik ; Hua, Fay ; Wong, C.P.
Author_Institution :
Georgia Inst. of Technol., Atlanta
fDate :
May 29 2007-June 1 2007
Abstract :
Tin/silver alloy nanoparticles with various sizes were synthesized by the chemical reduction method and their thermal properties were studied by differential scanning calorimetry. Both the particle size dependent melting temperature and latent heat of fusion have been observed. The melting point can be achieved as low as 194degC when the diameter of the nanoparticles is around 10 nm. The 64 nm (average diameter) SnAg alloy nanoparticle pastes showed good wetting properties on the cleaned copper foil surface and the intermetallic compounds formed. These low melting point SnAg alloy nanoparticles could be used for low temperature lead-free interconnect applications.
Keywords :
differential scanning calorimetry; interconnections; nanoparticles; silver alloys; solders; thermal management (packaging); tin alloys; wetting; SnAg; chemical reduction method; copper foil surface; differential scanning calorimetry; electronic packaging; intermetallic compounds; latent heat-of-fusion; lead-free solder applications; low temperature lead-free interconnect technology; nanoparticle pastes; particle size dependent melting temperature; thermal properties; tin-silver alloy nanoparticles; wetting properties; Calorimetry; Chemical technology; Copper alloys; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Nanoparticles; Silver; Temperature dependence; Tin alloys;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373776
