DocumentCode :
2876818
Title :
The effect of SiO2/SiNx bilayer structure on the bias and light-induced instability in InGaZnO TFTs
Author :
Ji, Kwang Hwan ; Kim, Ji-In ; Jung, Hong Yoon ; Park, Se Yeob ; Mo, Yeon-Gon ; Jeong, Jae Kyeong
Author_Institution :
Dept. of Mater. Sci. & Eng., Inha Univ., Incheon, South Korea
fYear :
2011
fDate :
4-7 July 2011
Firstpage :
1
Lastpage :
4
Abstract :
We investigated the effect of gate dielectric structure on the light-induced bias-temperature instability of IGZO TFT. After the application of light-induced negative bias stress, the SiO2/SiNx bilayer gate dielectric TFT exhibited the superior stability than single layer gate dielectric TFTs. Total applied electric field to bilayer gate dielectric layer(Device C) is -1.91MV/cm. However, electric field applied bilayer gate dielectrics divided between SiNx(-0.76MV/cm) and SiO2(-1.15MV/cm). In case of SiO2 single layer(Device A) effective electric field is -1.52MV/cm. This result indicates that bilayer gate dielectric structure has reducing electric field to gate dielectric. In addition, we observed different recovery behavior after negative bias temperature illumination stress. SiO2/SiNx bilayer TFT showed quickly recovery after stress as same as SiO2 single layer gate dielectric. This results can be explained photo-created charge temporary trapping at the SiO2/active interface. On the other hand, photo-created charge deeply injection to SiNx gate dielectric as well as trapping at the gate dielectrics/active interface.
Keywords :
thin film transistors; InGaZnO; SiO2-SiNx; bilayer gate dielectric TFT; bilayer gate dielectric layer; bilayer gate dielectric structure; electric field applied bilayer gate dielectrics; light-induced bias-temperature instability; light-induced instability; light-induced negative bias stress; negative bias temperature illumination stress; Charge carrier processes; Dielectrics; Electric fields; Films; Logic gates; Stress; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
ISSN :
1946-1542
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
Type :
conf
DOI :
10.1109/IPFA.2011.5992716
Filename :
5992716
Link To Document :
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