DocumentCode :
2876827
Title :
Effects of dopings on the electric-field-induced atomic migration and void formation in Ge2Sb2Te5
Author :
Yang, Tae-Youl ; Cho, Ju-Young ; Park, Yong-Jin ; Joo, Young-Chang
Author_Institution :
Dept. of Mater. Sci. & Eng., Seoul Nat. Univ., Seoul, South Korea
fYear :
2011
fDate :
4-7 July 2011
Firstpage :
1
Lastpage :
4
Abstract :
Electromigration in molten and crystalline Ge2Sb2Te5 (GST) was characterized using pulsed DC stress to an isolated line structure. In the electomigration of molten GST, the effects of N-and Bi-doping on the electromigration were aslo studied to find the solution for inhibiting the electromigration. When a single pulse (~10-3 s) was applied to the lines, both undoped and doped GST lines were melted by Joule heating, and Ge and Sb atoms migrate to the cathode, whereas Te atoms migrate to the anode. This elemental separation in the molten GST was caused by an electrostatic force-induced electromigration. The migration rate of the constituent atoms in the undoped GST was similar to that in Bi-doped GST, but was decreased by N-doping. Under applying a 10 MHz pulsed DC, the melting by Joule heating was inhibited, and electromigration in the crystalline state was detected. All constituent elements migrated to the cathode, which is originated from the electromigration by hole-windforce. This study provide the basic understanding about the degradation phenomena in phase change memory, and suggest the method for inhibiting the endurance failures.
Keywords :
antimony compounds; bismuth; electromigration; germanium compounds; liquid semiconductors; melting; nitrogen; phase change materials; phase change memories; semiconductor doping; voids (solid); Ge2Sb2Te5:Bi; Ge2Sb2Te5:N; Joule heating; crystalline state; degradation phenomena; doping effects; electric-field-induced atomic migration; electrostatic force-induced electromigration; elemental separation; hole-windforce; isolated line structure; melting; molten state; phase change memory; pulsed DC stress; void formation; Cathodes; Electric fields; Electromigration; Nitrogen; Phase change random access memory; Reliability; Stress; Ge2Sb2Te5; electromigration; phase change memory; reliability; set-stuck;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
ISSN :
1946-1542
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
Type :
conf
DOI :
10.1109/IPFA.2011.5992717
Filename :
5992717
Link To Document :
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