Design and Implementation of Embedded Miniature Bandpass Filters for RF-System-in-Organic-Package Applications

A simple bandpass filter architecture composed of three spiral inductors and two parallel-plate capacitors is presented to be suitable for being embedded in a low-cost organic laminate substrate for RF system-in-package applications. Although only five components are used, the presented organic bandpass filter designs can feature themselves with a third-order Chebyshev response plus multiple transmission zeros, resulting in a low and flat insertion loss in the passband as well as a high attenuation rate in the roll-off region. Due to the use of so few components, the organic bandpass filters implemented in the proposed architecture can be size-competitive with the low-temperature cofired ceramic (LTCC) bandpass filters.