Title :
Effect of Rare Earth Elements on Lead-Free Solder Microstructure Evolution
Author :
Pei, Min ; Qu, Jianmin
Author_Institution :
Georgia Inst. of Technol., Atlanta
fDate :
May 29 2007-June 1 2007
Abstract :
In this paper, quantitative microstructure studies were performed on multiple length scales to investigate effect of rare earth element (RE) doping on SnAg lead free solder materials. Variables considered in this paper include doping amount, aging temperature and aging time. It was found that RE doping refines the microstructure and reduces microstructure coarsening rate, but the inter-particle spacing remains unaffected. Therefore, higher RE doping level leads to higher volume fraction of the eutectic phase due to the increased total number of Ag3Sn particles.
Keywords :
ageing; doping profiles; grain size; integrated circuit packaging; particle size; rare earth metals; silver alloys; solders; thermal analysis; tin alloys; SnAg; aging temperature; aging time; eutectic phase; lead-free solder microstructure evolution; microelectronics packaging; microstructure coarsening rate reduction; multiple length scales; rare earth elements doping effects; Aging; Creep; Doping; Environmentally friendly manufacturing techniques; Lead; Microstructure; Packaging; Steel; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373798
