Title :
Material Properties and Intermetallic Compounds of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC)
Author :
Lau, John H. ; Pang, John H L ; Lee, Ning-Cheng ; Xu, Luhua
Author_Institution :
IME, Singapore
fDate :
May 29 2007-June 1 2007
Abstract :
In this study, the effect of a very low level of doping of Ce on the SnAgCu solder is investigated. Emphasis is placed on the determination of the material properties (such as the temperature and strain rate dependent Young´s modulus, yield stress, and ultimate strength) and the intermetallic compounds on OSP (organic solderability preservative) and NiAu (electroless Ni and immersion Au) FR-4 copper surface finishes of the new Sn3wt%Ag0.5wt%Cu0.019wt%Ce lead-free solder.
Keywords :
doping; electronic equipment manufacture; soldering; solders; OSP; doping; intermetallic compounds; organic solderability preservative; solder; Capacitive sensors; Copper; Doping; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Material properties; Stress; Surface finishing; Temperature dependence;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373800
