Title :
Whitening phenomena between polyphthalamide sidewall and silicone encapsulant in the light-emitting diode package
Author :
Lee, Kwang-Cheol ; Kim, Sang-Mook ; Oh, Hwa-Sub ; Baek, Jong Hyeob
Author_Institution :
Korea Photonics Technol. Inst., Gwangju, South Korea
Abstract :
White light-emitting diode (LED) packages are generally comprised of pre-mold leadframe, chip, wire, phosphor and encapsulant. During the high junction temperature operation, the whitening phenomena sometimes happen between leadframe sidewall and encapsulant resin. The nontrivial decrease of luminous flux results from the whitening originated from the decomposition mixture between polyphthalamide (PPA) sidewall and silicone resin.
Keywords :
electronics packaging; light emitting diodes; resins; silicones; chip; decomposition mixture; encapsulant resin; high junction temperature operation; leadframe sidewall; luminous flux; phosphor; polyphthalamide sidewall; pre-mold leadframe; silicone encapsulant; silicone resin; white light-emitting diode packages; whitening phenomena; wire; Degradation; Delamination; Junctions; Lead; Life estimation; Light emitting diodes; Phosphors;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2011.5992729
