DocumentCode :
2877080
Title :
Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization
Author :
Cason, Morgan ; Estrada, Raleigh
Author_Institution :
STMicroelectronics, Agrate Brianza, Italy
fYear :
2011
fDate :
4-7 July 2011
Firstpage :
1
Lastpage :
6
Abstract :
Several of the critical drawbacks to existing failure analysis imaging techniques, including the low resolution of common non-destructive techniques and the destructiveness and slow speed of FIB/SEM, can be resolved by using X-Ray Micro Computed Tomography (MicroCT) as a complementary technique. In this the paper, we describe examples of the use of X-Ray MicroCT following TDR as non-destructive technique to isolate solderability and bump void failure mechanisms. Also, use of X-Ray MicroCT for package construction analysis is described.
Keywords :
X-ray microscopy; computerised tomography; electronics packaging; failure analysis; focused ion beam technology; lead bonding; scanning electron microscopy; soldering; FIB; SEM; TDR; X-ray microCT; X-ray microcomputed tomography; failure analysis imaging technique; nondestructive failure analysis; package construction characterization; solderability isolation; void failure mechanism; wire bonding; Computer aided software engineering; Failure analysis; Scanning electron microscopy; Substrates; Three dimensional displays; Wires; X-ray imaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
ISSN :
1946-1542
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
Type :
conf
DOI :
10.1109/IPFA.2011.5992732
Filename :
5992732
Link To Document :
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